University Collaborations


Carleton University, Ottawa, Ontario, Canada
       Ongoing   Prof. Michele Nakhla
      
Joint postdoc for joint work with EDA, E. Fishkill

Georgia Institute of Technology
       Ongoing   Madhavan Swaminathan
   Alina Deutsch
   
Modeling, simulation, and measurement research for package analysis and material characterization with special emphasis on device model macromodeling, power distribution modeling, and transmission line measurements

McGill University, Montreal, Canada
       Ongoing      Albert Ruehli
   


University of Aquila, Italy
       Ongoing      Albert Ruehli
   


University of Arizona
       Ongoing   Kathleen Melde
John Prince
   Alina Deutsch
   
Developement of new characterization techniques for packaging interconnects that would allow material parameter extraction up to 100 GHz.

University of Hannover, Germany
       Ongoing   Hartmut Grabinski
Geyun Zhang
   Alina Deutsch
   
Developement of new characterization techniques for packaging interconnects that would allow material parameter extraction up to 100 GHz.

University of Illinois at Urbana-Champagne
       Ongoing   Prof. Andreas Cangellaris