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Last Thirty Days
Report Title
Author(s)
Report Number
Paper Name
1.
Application Note: FPGA to IBM Power Processor Interface Setup
Ibrahim Ouda; Kai Schleupen
RC24596
rc24596.pdf
2.
Algebraic Properties in Alice and Bob Notation (Extended Version)
Sebastian Moedersheim
RZ3709
rz3709.pdf
3.
Investigating Indirect Dependencies in Bipartite Cliques of IT Infrastructure Topology
Istvan Szombath
RZ3714
rz3714.pdf
4.
Scalable Algorithm for Distributed In-Memory Text Indexing
Ankur Narang, Vikas Agarwal, Monu Kedia, Vijay K Garg
RI08009
lucenebg-resrep.pdf
5.
The Evolution of Microstructure and Microhardness of Sn-Ag and Sn-Cu Solders during High Temperature Aging
Sun-Kyoung Seo; Sung K. Kang; Da-Yuan Shih; Hyuck Mo Lee
RC24579
rc24579.doc
6.
Effects of Under Bump Metallization and Nickel Alloying Element on the Undercooling Behavior of Sn-based, Pb-free Solders
Moon Gi Cho; Sung K. Kang; Sun-Kyoung Seo; Da-Yuan Shih; Hyuck Mo Lee
RC24580
rc24580.pdf
7.
An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate
Sun-Kyoung Seo; Sung K. Kang; Da-Yuan Shih; Hyuck Mo Lee
RC24581
rc24581.pdf
8.
An Overview of Pb-free, Flip-Chip Wafer Bumping Technologies
Sung K. Kang; Peter Gruber; Da-Yuan Shih
RC24582
rc24582.pdf
9.
Undercooling and Microhardness of Pb-free Solders on Various UBMs
Moon Gi Cho; Sung K. Kang; Hyuck Mo Lee
RC24583
rc24583.pdf
10.
Analyzing Dispensing Plan for Emergency Medical Supplies in the Event of Bioterrorism
Young M. Lee
RC24576
rc24576.pdf
11.
Managing Workforce Resource Actions with Multiple Feedback Control Schemes
Young M. Lee; Lianjun An; Daniel Connors
RC24575
rc24575.pdf
12.
Inventory Mmanagement under Price Protection
Karthik Sourirajan; Roman Kapuscinski; Markus Ettl; Pu Huang
RC24577
rc24577.pdf
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