IBM Journal of Research and Development
IBM Skip to main content
  Home     Products & services     Support & downloads     My account  

  Select a country  
Journals Home  
  Systems Journal  
Journal of Research
and Development
  ·  Current Issue  
  ·  Recent Issues  
  ·  Papers in Progress  
  ·  Search/Index  
  ·  Orders  
  ·  Description  
  ·  Patents  
  ·  Recent publications  
  ·  Author's Guide  
  Staff  
  Contact Us  
  Related links:  
     IBM Research  

IBM Journal of Research and Development  
Volume 40, Number 1, Page 119 (1996)
Terrestrial cosmic rays and soft errors
  Full article: arrowPDF   arrowCopyright info





   

Critical charge calculations for a bipolar SRAM array

by L. B. Freeman
The critical charge, Qcrit, of a memory array storage cell is defined as the largest charge that can be injected without changing the cell's logic state. The Qcrit of a Schottky-coupled complementary bipolar SRAM array is evaluated in detail. An operational definition of critical charge is made, and the critical charge for the cell is determined by circuit simulation. The dependence of critical charge on upset-pulse wave shape, statistical variations of power supply voltage, temperature gradients, manufacturing process tolerances, and design-related influences due to word- and drain-line resistance was also calculated. A 2× range in Qcrit is obtained for the SRAM memory array cell from simulations of normal (±3σ) variations in manufacturing process tolerances, the shape of the upset current pulse, and local cell temperatures. Using SEMM, a 60× variation of the soft-error rate (SER) is obtained for this range in Qcrit. The calculated SER is compared to experimental values for the chip obtained by accelerated testing. It is concluded that a range in values of the critical charge of a cell due to normal manufacturing and operating tolerances must be considered when calculating soft-error rates for a chip.
Related Subjects: Circuit theory and analysis; Cosmic rays; Integrated circuit design; Models and modeling; Reliability; Soft errors