IBM Journal of Research and Development
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IBM Journal of Research and Development

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Related Papers
2007High-speed interconnect and packaging design of the IBM System z9 processor cage
2007High-speed source-synchronous interface for the IBM System z9 processor
2007Optimization of silicon technology for the IBM System z9
2006Two-level BEOL processing for rapid iteration in MRAM development
2005Blue Gene/L torus interconnection network
2005Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
2005Exploitation of optical interconnects in future server architectures
2005Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects
2005Low-cost wafer bumping
2005Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
2005The chemistry of additives in damascene copper plating
2004Processor subsystem interconnect architecture for a large symmetric multiprocessing system
2002 Land grid array sockets for server applications
2002An advanced multichip module (MCM) for high-performance UNIX servers
2002First- and second-level packaging for the IBM eServer z900
2002IBM eServer z900 I/O subsystem
2002Interconnect opportunities for gigascale integration
2002Reliability limits for the gate insulator in CMOS technology
2000The future of interconnection technology
1999Fiber optic interconnects for the IBM S/390 Parallel Enterprise Server G5
1998Damascene copper electroplating for chip interconnections
1998Electrochemical process for advanced package fabrication
1998Electrolessly deposited diffusion barriers for microelectronics
1998Thin-film multichip module packages for high-end IBM servers
1996Circuit placement, chip optimization, and wire routing for IBM IC technology
1995A half-micron CMOS logic generation
1995Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
1995Interconnect design with VLSI CMOS
1995Interconnect fabrication processes and the development of low-cost wiring for CMOS products
1995Low-temperature chemical vapor deposition processes and dielectrics for microelectronic circuit manufacturing at IBM
1995Modeling and characterization of long on-chip interconnections for high-performance microprocessors
1995Silicides and local interconnections for high-performance VLSI applications
1995The evolution of interconnection technology at IBM
1995VLSI on-chip interconnection performance simulations and measurements
1993Attachment of Solder Ball Connect (SBC) packages to circuit cards
1993Finite element analysis for Solder Ball Connect (SBC) structural design optimization
1993Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations
1993Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation
1993Thermal modeling of the infrared reflow process for Solder Ball Connect (SBC)
1992A four-level VLSI bipolar metallization design with chemical-mechanical planarization
1992Advancing the state of the art in high-performance logic and array technology
1992Electrical connections to the thermal conduction modules of the IBM Enterprise System/9000 water-cooled processors
1992Enterprise Systems Connection (ESCON) Architecture-System overview
1992Fiber Distributed Data Interface attachment to System/390
1992IBM Enterprise Systems multimode fiber optic technology
1992Physical and electrical design features of the IBM Enterprise System/9000 circuit module
1992The IBM Enterprise Systems Connection (ESCON) Director: A dynamic switch for 200Mb/s fiber optic links
1991IBM Enterprise System/9000 Type 9121 Model 320 air-cooled processor technology
1990Compound semiconductor heterostructure bipolar transistors
1990On-chip wiring for VLSI: Status and directions
1982Development of Interconnection Technology for Large-Scale Integrated Circuits