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Related Papers
2006
Product-representative “at speed” test structures for CMOS characterization
2005
Design and modeling of equipment used in electrochemical processes for microelectronics
2005
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
2005
Low-cost wafer bumping
2001
Modular server frame with robust earthquake retention
1999
Key measurements of ultrathin gate dielectric reliability and in-line monitoring
1999
Sputter deposition for semiconductor manufacturing
1998
Metallization by plating for high-performance multichip modules
1998
Polarographic methods of monitoring addition agents in the electroplating of Sn–Pb solders
1998
Thin-film multichip module packages for high-end IBM servers
1997
Manufacturing with DUV lithography
1996
IBM experiments in soft fails in computer electronics (1978-1994)
1995
Integrated cost and productivity learning in CMOS semiconductor manufacturing
1994
ABC: A better control for manufacturing
1994
Implementation of the PowerPC 601 microprocessor
1993
Architecture and performance of the ESPER-2 hard-disk drive servo writer
1993
Attachment of Solder Ball Connect (SBC) packages to circuit cards
1993
Component procurement and allocation for products assembled to forecast: Risk-pooling effects
1993
Flexible simulation of a complex semiconductor manufacturing line using a rule-based system
1993
Head actuator dynamics of an IBM 5 ¼-inch disk drive
1993
Statistical modeling in manufacturing: Adapting a diagnostic tool to real-time applications
1992
Equipment-related advances in the fabrication of glass-ceramic/copper/polyimide substrates
1992
Integrated processing for microelectronics science and technology
1991
A 128Kb CMOS static random-access memory
1987
Solid modeling for production design
1987
Some aspects of the theory of statistical control schemes
1986
On yield, fault distributions, and clustering of particles
1985
A prototype manufacturing knowledge base in Syllog
1985
Advanced bipolar transistor modeling: Process and device simulation tools for today's technology
1985
An algorithm for carrier routing in a flexible material-handling system
1985
Analysis of manufacturing systems by the Research Queueing Package
1985
Animation and 3D color display of multiple-variable data: Application to semiconductor design
1985
FEDSSA 2D semiconductor fabrication process simulator
1985
Integrated Manufacturing Modeling System
1985
On the analysis and design of CUSUM-Shewhart control schemes
1985
Scheduling algorithms for flexible flow lines
1985
Semiconductor device simulation using generalized mobility models
1985
Short-term production scheduling of an automated manufacturing facility
1985
The effects of wafer to wafer defect density variations on integrated circuit defect and fault distributions
1985
The generation of three-dimensional bipolar transistor models for circuit analysis
1985
Two-dimensional device simulation program: 2DP
1985
Two-dimensional process modeling: A description of the SAFEPRO program
1985
VLSI wiring capacitance
1984
Preface: Advances in materials and processes for printed circuit packaging technology
1983
A Model for the Prediction of Assembly, Rework, and Test Yields
1983
Computer-Controlled Optical Testing of High-Density Printed-Circuit Boards
1983
Failure Diagnosis on the LT1280
1983
Large Multi-Layer Panel-Drilling System
1983
Multi-Chip Module Test and Diagnostic Methodology
1983
Multi-Layer Ceramics Manufacturing
1983
Precise Numerical Control for the Thermal Conduction Module
1983
Product Quality Level Monitoring and Control for Logic Chips and Modules
1983
Row-by-Row Dynamic Image Analysis of a Matrix of Scanned Points
1983
The LT1280 for Through-the-Pins Testing of the Thermal Conduction Module
1982
Evolution and Accomplishments of VLSI Yield Management at IBM
1982
Feature Size Control in IC Manufacturing
1982
High-Density Board Fabrication Techniques
1982
Immersion Wave Soldering Process
1982
Metrology in Mask Manufacturing
1982
Optimization of Plasma Processing for Silicon-Gate FET Manufacturing Applications
1982
Oxygen Incorporation and Precipitation in Czochralski-Grown Silicon
1982
Plant Automation in a Structured Distributed System Environment
1982
Process Control of the Chlorobenzene Single-Step Liftoff Process with a Diazo-Type Resist
1982
Quality and Reliability Assurance Systems in IBM Semiconductor Manufacturing
1982
Semiconductor Final Test Logistics and Product Dispositioning Systems
1982
Semiconductor Manufacturing Technology at IBM
1981
Semiconductor Manufacturing in IBM, 1957 to the Present: A Perspective
1980
Registration Mark Detection for Electron-Beam LithographyEL1 System
1972
Acoustic Signal Analysis for Noise Source Identification in Mechanisms
1972
Design and Fabrication of Heat Transfer Surfaces from Superplastic Material
1972
Detection of Discontinuities in Passivating Layers on Silicon by NaOH Anisotropic Etch
1972
Development of Water-soluble Systems for Use in Industrial Soldering Processes
1972
Holographic Interferometry Deformation Study of a Printer Type-piece
1972
Monitoring Microinch Displacements in Ultrasonic Welding Equipment
1972
Silicon Process Technology for Monolithic Memory
1971
A Design Study of Ultrasonic Bonding Tips
1970
A Transmission Control Unit for High-speed Computer-to-computer Communication
1970
An Integrated Manufacturing Process Control System: Implementation in IBM Manufacturing
1970
Computer-aided Testing and Fabrication of Magnetic Tape Heads
1970
IBM System/7 and Plant Automation
1970
Indium-mercury Alloy as a Low-toxicity Liquid Electrode
1970
Integrated Manufacturing Systems: Architectural Considerations
1970
PCOS: A Process Control Extension to Operating System/360
1970
Precision Automatic Measuring of
X-Y
Coordinates
1969
A Nonlinear Digital Filter for Industrial Measurements
1969
Dynamic Inventory Models and Stochastic Programming
1969
High Performance Reduction Lenses for Microelectronic Circuit Fabrication
1969
Stochastic Model for Manufacturing Cost Estimating
1967
A Computer-Operated Manufacturing and Test System
1957
Simple Constant-Temperature Oven and Control System
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