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2007	High-speed interconnect and packaging design of the IBM System z9 processor cage
2007	Redundant I/O interconnect
2005	BladeCenter packaging, power, and cooling
2005	Challenges of data center thermal management
2005	Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
2005	Effects of mechanical stress and moisture on packaging interfaces
2005	Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements
2005	Mixing, rheology, and stability of highly filled thermal pastes
2005	Packaging the Blue Gene/L supercomputer
2005	The evolution of build-up package technology and its design challenges
2004	Configurable system simulation model build comprising packaging design data
2004	First- and second-level packaging of the z990 processor cage
2004	Packaging the IBM eServer z990 central electronic complex
2003	Developing integrated antenna subsystems for laptop computers
2002	Land grid array sockets for server applications
2002	A power, packaging, and cooling overview of the IBM eServer z900
2002	An advanced multichip module (MCM) for high-performance UNIX servers
2002	Design and analysis of a scheme to mitigate condensation on an assembly used to cool a processor module
2002	First- and second-level packaging for the IBM eServer z900
2002	High-end server low-temperature cooling
2002	POWER4 system microarchitecture
2001	Strain measurement and numerical analysis of an epoxy adhesive subjected to thermal loads
2000	Monolithic packaging concepts for high isolation in circuits and antennas
2000	Solid Logic Technology: Versatile, high-performance microelectronics
1998	Applications of electrochemical microfabrication: An introduction
1998	Damascene copper electroplating for chip interconnections
1998	Electrochemical process for advanced package fabrication
1998	Metallization by plating for high-performance multichip modules
1998	Thin-film multichip module packages for high-end IBM servers
1993	Attachment of Solder Ball Connect (SBC) packages to circuit cards
1993	Finite element analysis for Solder Ball Connect (SBC) structural design optimization
1993	Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations
1993	Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation
1993	Thermal-mechanical strain characterization for printed wiring boards
1993	Thermal modeling of the infrared reflow process for Solder Ball Connect (SBC)
1992	Aspects of the electrical design and analyses of the printed circuit boards of the IBM Enterprise System/9000 water-cooled processors
1992	Electrical connections to the thermal conduction modules of the IBM Enterprise System/9000 water-cooled processors
1992	Equipment-related advances in the fabrication of glass-ceramic/copper/polyimide substrates
1992	High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution
1992	Low-inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors
1992	Physical and electrical design features of the IBM Enterprise System/9000 circuit module
1991	IBM Enterprise System/9000 Type 9121 Model 320 air-cooled processor technology
1991	IBM System/390 air-cooled alumina thermal conduction module
1990	An electromagnetic approach for modeling high-performance computer packages
1990	Electron-beam technology for open/short testing of multi-chip substrates
1988	Characterization of a bis-maleimide triazine resin for multilayer printed circuit boards
1988	Characterization of PdSn catalysts for electroless metal deposition
1988	Chemistry at interfaces: Electropositive metals on polymer surfaces
1988	Delocalized bonding at the metal–polymer interface
1988	Developer-induced debonding of photoresist from copper
1988	Electrical design of signal lines for multilayer printed circuit boards
1988	Improvement of adhesion of copper on polyimide by reactive ion-beam etching
1988	Ion transport through protective polymeric coatings exposed to an aqueous phase
1988	Physical limits to the useful packaging density of electronic systems
1988	Surface analysis and characterization of large printed-circuit-board circuitization process steps
1987	Signal degradation through module pins in VLSI packaging
1985	A dielectric loss investigation of moisture in epoxy-glass composites
1985	Cathodic delamination of methyl methacrylate-based dry film polymers on copper
1984	High-temperature stability of a polyimide film
1984	Initiation of electroless Cu plating on nonmetallic surfaces
1984	Mechanisms of electroless metal plating: II. Decomposition of formaldehyde
1984	Mechanisms of electroless metal plating: I. Mixed potential theory and the interdependence of partial reactions
1984	Micromechanics of multilayer printed circuit boards
1984	Moisture solubility and diffusion in epoxy and epoxy-glass composites
1984	Optimization of interconnections between packaging levels
1984	Preface: Advances in materials and processes for printed circuit packaging technology
1983	Automated Twisted-Pair Wire Bonding
1983	Computer-Controlled Optical Testing of High-Density Printed-Circuit Boards
1983	Large Multi-Layer Panel-Drilling System
1983	Multi-Chip Module Test and Diagnostic Methodology
1983	Multi-Layer Ceramics Manufacturing
1983	The LT1280 for Through-the-Pins Testing of the Thermal Conduction Module
1982	A Conduction-Cooled Module for High-Performance LSI Devices
1982	A New Set of Printed-Circuit Technologies for the IBM 3081 Processor Unit
1982	Advanced Printed-Circuit Board Design for High-Performance Computer Applications
1982	Conduction Cooling for an LSI Package: A One-Dimensional Approach
1982	Development of Interconnection Technology for Large-Scale Integrated Circuits
1982	Electrical Design of a High Speed Computer Package
1982	High-Density Board Fabrication Techniques
1982	Influence on LSI Package Wireability of Via Availability and Wiring Track Accessibility
1982	Model for Transient and Permanent Error-Detection and Fault-Isolation Coverage
1982	Optimization of Indium-Lead Alloys for Controlled Collapse Chip Connection Application
1982	The Thin-Film Module as a High-Performance Semiconductor Package
1982	Thermal Conduction Module: A High-Performance Multilayer Ceramic Package
1981	Coupled Lossy Transmission Line Characterization and Simulation
1981	Design Automation in IBM
1981	Electronic Packaging Evolution in IBM
1981	Number of Vias: A Control Parameter for Global Wiring of High-Density Chips
1981	Techniques for Improving Engineering Productivity of VLSI Designs
1980	An Overview of Josephson Packaging
1980	Defect-Related Breakdown and Conduction in SiO2
1980	The Characteristics of Chip-to-Chip Signal Propagation in a Package Suitable for Superconducting Circuits
1979	Exploiting Symmetry in Electrical Packaging Analysis
1979	Potential Distribution and Multi-Terminal DC Resistance Computations for LSI Technology
1979	Resistive and Inductive Skin Effect in Rectangular Conductors
1979	Survey of Computer-Aided Electrical Analysis of Integrated Circuit Interconnections
1979	Three-Dimensional Inductance Computations with Partial Element Equivalent Circuits
1979	Transient Analysis of Uniform Resistive Transmission Lines in a Homogeneous Medium
1964	Solid Logic Design Automation
1964	Solid Logic Technology: Versatile, High-Performance Microelectronics
1963	A Circuit Packaging Model for High-Speed Computer Technology