IBM Journal of Research and Development
IBM Skip to main content
  Home     Products & services     Support & downloads     My account  

  Select a country  
Journals Home  
  Systems Journal  
Journal of Research
and Development
    Current Issue  
    Recent Issues  
    Papers in Progress  
    Recent publications  
    Author's Guide  
  Contact Us  
  Related links:  
     IBM Research  

IBM Journal of Research and Development  
Volume 27, Number 6, Page 598 (1983)
Nontopical Issue
  Full article: arrowPDF   arrowCopyright info


Automated Twisted-Pair Wire Bonding

by D. E. Houser, K. J. Lubert
A need for highly dense and reworkable external interconnections with controlled characteristic impedance on high-performance printed-circuit boards led to the development of the process and equipment described in this paper. These interconnections are required to implement engineering changes, to install precise circuit delays, to repair printed-circuit defects, and to complete interconnections not possible with printed circuitry alone. As an economical way to meet the characteristic impedance requirement of 80 ± 10 Ω and the density requirement for terminations on a 2.5-mm “staggered” grid (twice as dense as a 2.5-mm-square grid), 39-gauge twisted-pair wire is used. A solder-reflow process bonds the wires to the printed circuitry and meets the need for reworkability. Computer-controlled equipment, developed to install twisted-pair wires at production rates, is now being used in several IBM plants worldwide.
Related Subjects: Computer-controlled manipulators; Fabrication; Packaging