IBM Journal of Research and Development
IBM Skip to main content
  Home     Products & services     Support & downloads     My account  

  Select a country  
Journals Home  
  Systems Journal  
Journal of Research
and Development
    Current Issue  
    Recent Issues  
    Papers in Progress  
    Search/Index  
    Orders  
    Description  
    Patents  
    Recent publications  
    Author's Guide  
  Staff  
  Contact Us  
  Related links:  
     IBM Research  

IBM Journal of Research and Development  
Volume 32, Number 5, Page 647 (1988)
Electronic Packaging
  Full article: arrowPDF   arrowCopyright info





   

Electrical design of signal lines for multilayer printed circuit boards

by C. S. Chang
Key aspects of the electrical design of signal lines for multilayer printed circuit boards used in computers are examined. Illustrative calculations are carried out for several signal-line configurations, and associated means are presented for selecting design trade-offs regarding cross talk and skin-effect-induced delay.
Related Subjects: Packaging