IBM Journal of Research and Development
IBM Skip to main content
  Home     Products & services     Support & downloads     My account  

  Select a country  
Journals Home  
  Systems Journal  
Journal of Research
and Development
    Current Issue  
    Recent Issues  
    Papers in Progress  
    Recent publications  
    Author's Guide  
  Contact Us  
  Related links:  
     IBM Research  

IBM Journal of Research and Development  
Volume 32, Number 5, Page 591 (1988)
Electronic Packaging
  Full article: arrowPDF   arrowCopyright info


Characterization of PdSn catalysts for electroless metal deposition

by E. J. M. O'Sullivan, J. Horkans, J. R. White, J. M. Roldan
A set of electrochemical techniques has been developed to measure the component concentrations and the catalytic activity of the PdSn seeder solutions used to activate insulating substrates for the electroless deposition of Cu. The concentration of Sn(II) was calculated from the limiting current for Sn(II) oxidation, that of Sn(IV) from the difference between the Sn metal-deposition limiting current and the Sn(II) limiting current. The palladium concentration was determined by a stripping analysis after Pd deposition from an oxidized seeder solution. The catalytic activity of the PdSn catalyst was estimated by measuring its activity for the electro-oxidation of formaldehyde (the reducing agent used in the electroless Cu bath) or by the cyclic voltammetric response of a seeded electrode in an inert electrolyte. The cyclic voltammetric technique and transmission electron microscopy examination were used to evaluate various accelerating solutions used to increase the activity of the seeder.
Related Subjects: Films, thin; Interfaces; Materials; Packaging; Surface science