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IBM Journal of Research and Development  
Volume 32, Number 5, Page 631 (1988)
Electronic Packaging
  Full article: arrowPDF   arrowCopyright info


Developer-induced debonding of photoresist from copper

by A. L. Ruoff, E. J. Kramer, C.-Y. Li
We describe the debonding of a polymeric photoresist film bonded to a thin copper substrate as a result of the diffusion of an organic penetrant into the polymer. The diffusion profile (measured by Rutherford backscattering spectroscopy) consisted of a uniformly swollen layer behind a sharp front which propagated into the polymer at a uniform velocity. Debonding always occurred when the front had penetrated about 12 μm into the polymer (about 1/5 its thickness). The debonding was driven by the release of elastic strain energy created by the swelling.
Related Subjects: Films, thin; Interfaces; Materials; Packaging; Photoresists; Polymers; Surface science