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IBM Journal of Research and Development  
Volume 23, Number 1, Page 24 (1979)
Sputtering and Plasma Etching
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Sputtering Process Model of Deposition Rate

by J. H. Keller, R. G. Simmons
A model of the sputtering process has been developed that predicts the deposition rate of a sputtering system with parallel-plate geometry. By using data for sputtering yield vs voltage obtained from an ion-beam sputtering system, the model applies a new theory for computing the backscatter of the sputtered material, and, from the results, predicts deposition rates. The model also considers the effects of charge exchange in the sheaths, and of re-emission of sputtered material at the substrate. The model is valid for magnetic, tuned substrate, driven substrate, and controlled area ratio diode systems. Comparison with observed deposition rates shows good agreement for clean systems. An experimental APL program that uses the model has been written.
Related Subjects: Models and modeling; Sputtering