Signal degradation through module pins in VLSI packaging
by C.-C. Huang, L. L.-H. Wu
This paper investigates chip-to-chip communication through the modules and board in VLSI packaging. Transmission line models and frequency-dependent transmission line parameters are used in finding the frequency response. The time-domain solution is then obtained through the inverse Fast Fourier Transform. The results show that uncoated module pins, even of relatively short length, can cause severe signal degradation because of their magnetic property. The signal behavior is improved dramatically, however, when the module pins are coated with nonmagnetic conductive material.