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IBM Journal of Research and Development  
Volume 31, Number 5, Page 585 (1987)
Formal Definition/Design of Computer Systems
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Delamination and fracture of thin films

by E. Klokholm
The fracture and delamination of thin films is a relatively common occurrence, and prevention of these mechanical failures is essential for the successful manufacture of thin-film devices. Internal elastic stresses are an inherent part of the thin-film deposition process, and are largely responsible for the mechanical failures of thin films. However, it is not the magnitude of the film stress S which governs film fracture or delamination, but the elastic energy U stored in the film. It is the intent of this presentation to show that the mechanical stability of the film and the substrate requires that U be less than a critical value Uc and that Uc is dependent upon the surface energy γ.
Related Subjects: Films, thin; Physics