IBM Journal of Research and Development
IBM Skip to main content
  Home     Products & services     Support & downloads     My account  

  Select a country  
Journals Home  
  Systems Journal  
Journal of Research
and Development
    Current Issue  
    Recent Issues  
    Papers in Progress  
    Recent publications  
    Author's Guide  
  Contact Us  
  Related links:  
     IBM Research  

IBM Journal of Research and Development  
Volume 27, Number 1, Page 11 (1983)
Manufacturing Technology - Packaging
  Full article: arrowPDF   arrowCopyright info


Multi-Layer Ceramics Manufacturing

by W. G. Burger, C. W. Weigel
Multi-layer ceramics (MLC) is an advanced packaging technology developed by IBM and used in the IBM 4300 and IBM 3081 processor models to significantly improve the module circuit density, reliability, and performance over those of previous packages. A key element in this package is the MLC substrate, which is capable of supporting more than 100 semiconductor chips in some design uses. The MLC manufacturing facility requires that sophisticated processing and inspection/test equipment operate within a hierarchically integrated system. This paper provides an overview of the manufacturing process that has been implemented to satisfy the high-volume manufacturing needs of this complex package. It also describes the data handling systems.
Related Subjects: Fabrication; Manufacturing; Packaging