IBM Journal of Research and Development
IBM Skip to main content
  Home     Products & services     Support & downloads     My account  

  Select a country  
Journals Home  
  Systems Journal  
Journal of Research
and Development
    Current Issue  
    Recent Issues  
    Papers in Progress  
    Recent publications  
    Author's Guide  
  Contact Us  
  Related links:  
     IBM Research  

IBM Journal of Research and Development  
Volume 32, Number 5, Page 616 (1988)
Electronic Packaging
  Full article: arrowPDF   arrowCopyright info


Characterization of a bis-maleimide triazine resin for multilayer printed circuit boards

by J. T. Gotro, B. K. Appelt
The thermosetting resin investigated in this study was a mixture of bis-maleimide and bis-cyanate, frequently referred to as BT (bis-maleimide triazine). For printed circuit board applications, a brominated epoxy resin was blended with BT to impart flame resistance. Resin curing was extensively investigated using a combination of thermoanalytical techniques (thermal analysis, heated-cell infrared spectroscopy, dynamic mechanical analysis, and microdielectrometry). Differential scanning calorimetry indicated a minimum of two separate reactions. Fourier-transform infrared spectroscopy provided more detailed information on the cross-linking reactions during the curing. The onset of cyclotrimerization was found to appear at 150°C, correlating with one of the peaks observed in the differential scanning calorimetry measurements. Dynamic mechanical methods were used to investigate the viscosity profile during simulated lamination temperature profiles. Microdielectrometry performed simultaneously with parallel-plate rheometry provided further insight into the physical changes that occur during lamination.
Related Subjects: Materials; Packaging; Polymers