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IBM Journal of Research and Development  
Volume 26, Number 3, Page 286 (1982)
Computer Packaging
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The Thin-Film Module as a High-Performance Semiconductor Package

by C. W. Ho, D. A. Chance, C. H. Bajorek, R. E. Acosta
This paper discusses a multichip module for future VLSI computer packages on which an array of silicon chips is directly attached and interconnected by high-density thin-film lossy transmission lines. Since the high-performance VLSI chips contain a large number of off-chip driver circuits which are allowed to switch simultaneously in operation, low-inductance on-module capacitors are found to be essential for stabilizing the on-module power supply. Novel on-module capacitor structures are therefore proposed, discussed, and evaluated. Material systems and processing techniques for both the thin-film interconnection lines and the capacitor structures are also briefly discussed in the paper. Development of novel defect detection and repair techniques has been identified as essential for fabricating the Thin-Film Module with practical yields.
Related Subjects: Analytical models; Fabrication; LSI; Packaging