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IBM Journal of Research and Development  
Volume 26, Number 5, Page 590 (1982)
Semiconductor Manufacturing Technology
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The Mechanism of Single-Step Liftoff with Chlorobenzene in a Diazo-Type Resist

by R. M. Halverson, M. W. MacIntyre, W. T. Motsiff
The mechanism of the chlorobenzene single-step liftoff process is defined. The chlorobenzene penetrates to some depth into the resist film during the soaking cycle, extracting residual casting solvent and low-molecular-weight resin species. The chlorobenzene is subsequently removed by a rinse cycle. The penetrated layer of resist develops at a slower rate than the underlying bulk resist, producing the liftoff structure.
Related Subjects: Chemistry and chemical engineering; Films, Diazo; Lithography; Materials; Semiconductor technology